Hitachi Metals Installs EBAM System

Sciaky, Inc. (Chicago, IL), a subsidiary of Phillips Service Industries, Inc. (PSI; Livonia, MI) and leading provider of metal additive manufacturing (AM) systems, delivered an Electron Beam Additive Manufacturing (EBAM®) system to the Global Research & Innovative Technology (GRIT) facility of Hitachi Metals, Ltd. (Kumagaya, Japan), making it their first Asia-Pacific installation. Hitachi Metals offers products and materials that contribute to better quality and productivity, as well as energy conservation. They have fortified unique development and technological strengths in four business segments: Specialty Steel Products, Magnetic Materials and Applications, Functional Components and Equipment, as well as Wires, Cables and Related Products.

The EBAM 110 system they purchased includes a dual wirefeed configuration that can combine two different metal alloys into a single melt pool, managed with independent program control, to create custom alloy parts or ingots. Users also have the option to alternate between different wire gauges for finer deposition features (thin wire) and gross deposition features (thick wire) to meet unique part specifications. “We are proud to extend our technology with them,” said Scott Phillips, the president and chief executive officer of Sciaky. “This is an important milestone for the industrial metal 3D printing market in Japan, and their forward-thinking leaders are blazing a new trail for the Asia-Pacific region.”

“We are pleased to launch our new metal wire additive manufacturing technology with the procurement of this EBAM 110 metal 3D printing system in our GRIT facility,” added Yasuhiko Ohtsubo, the 3DAM development manager of GRIT. “We look forward to developing new materials and applications with this highly innovative process.” As one of the most widely scalable metal additive manufacturing systems in the industry (in terms of work envelope), these EBAM systems can produce parts ranging from 8 in (203 mm) to 19 ft (5.79 m) long. properties, microstructure, and metal chemistry, from the first part to the last.

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