PRECISION DOWN TO THE SMALLEST DETAIL: LASER ADDRESSES GROWING MICRO-PROCESSING MARKET
Trumpf?s TruMicro 7050 features an outstanding productivity for ablative microprocessing tasks. Based on disk laser technology, the newest Trumpf micro-processing laser covers applications requiring high average output powers and micro second pulses. Delivering more than 500 watts, the TruMicro 7050 provides high output power while maintaining a high beam quality.
Posted: April 22, 2009
Trumpf?s TruMicro 7050 features an outstanding productivity for ablative micro processing tasks. Based on disk laser technology, the newest Trumpf micro-processing laser covers applications requiring high average output powers and micro second pulses. These short pulses are generated using Q-switch technology. Delivering more than 500 watts, the TruMicro 7050 provides high output power while maintaining a high beam quality of 4 mm*mrad making this laser perfect for highly productive remote cutting, drilling and ablation processes.
Its scanner connection also allows the TruMicro 7050 to process complex shapes. This opens up a wide variety of applications, such as edge de-lamination of thin film solar cells and preparing coated, tailored blanks for welding. The beam is transported from the laser to the workpiece by a laser light cable, a feature that allows easy integration of the unit into systems. Industrial micro processing lasers must meet established standards for reliability and availability and, if they are to deliver cost-effective rates of material removal, must also provide high levels of ablation speeds and powers. Trumpf?s TruMicro series lasers are especially suited to meeting these increased demands on short and ultrashort pulsed lasers. Their high pulse-to-pulse, output and pointing stability gives them a key advantage, and Trumpf aims to ensure laser parameters have maximum reproducibility and stability.